Test Cost Modeling for 3D Stacked Chips with Through-Silicon Vias
The 11th Swedish System-on-Chip Conference, Varberg, Sweden, May 2-3, 2011 (not reviewed, not printed).
ABSTRACT
In this paper we have proposed a test cost model for core-based 3D Stacked ICs (SICs) connected by Through Silicon Vias (TSVs). Unlike in the case of non-stacked chips, where the test flow is well defined by applying the same test schedule both at wafer sort and at package test, the most cost-efficient test flow for 3D TSV-SICs is yet undefined. Therefore, analysing the various alternatives of test flow, we present a cost model with the optimal test flow. In the test flow alternatives, we analyse the effect of all possible moments of testing for a 3D TSV-SIC, viz., wafer sort, intermediate test and package test. For the optimal test flow, we have performed experiments with various varying yield and test time parameters, which further support our claim.
[SIL11] Breeta SenGupta, Urban Ingelsson, Erik Larsson, "Test Cost Modeling for 3D Stacked Chips with Through-Silicon Vias", The 11th Swedish System-on-Chip Conference, Varberg, Sweden, May 2-3, 2011 (not reviewed, not printed). |
|
