Cost Reduction of Wear-Out Monitoring by Measurement Point Selection
The 11th Swedish System-on-Chip Conference, Varberg, Sweden, May 2-3, 2011 (not reviewed, not printed).
ABSTRACT
Early failure rates have increased due to reduced feature dimensions and electromigration wear-out. Periodic delay measurements can be employed to estimate the state of wear-out. Including delay measurement sensors on-chip is costly. Therefore, a method is proposed to reduce the number of measurement points. The method identi?es wear-out sensitive interconnects and selects a small number of measurement points to target the identi?ed interconnects. The method is demonstrated on ISCAS85 benchmark ICs.
[ICL11] Urban Ingelsson, Shih-Yen Chang, Erik Larsson, "Cost Reduction of Wear-Out Monitoring by Measurement Point Selection", The 11th Swedish System-on-Chip Conference, Varberg, Sweden, May 2-3, 2011 (not reviewed, not printed). |
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