Temperature-Gradient Based Burn-In and Test Scheduling for 3D Stacked ICs
IEEE Transactions on Very Large Scale Integration Systems (VLSI 2015).
ABSTRACT
[APE15] Nima Aghaee, Zebo Peng, Petru Eles, "Temperature-Gradient Based Burn-In and Test Scheduling for 3D Stacked ICs", IEEE Transactions on Very Large Scale Integration Systems (VLSI 2015). |
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