The IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis is the premier event in design of embedded systems hardware, software and tools. We are proud to continue the tradition of upholding high quality in an open forum for promoting active discussion on innovative topics. The program actively seeks industry participation. High quality original papers will be accepted for oral presentation followed by interactive poster sessions. Proceedings are published by ACM SIGDA, and selected papers from the conference proceedings will be targeted for journal publication in a special issue.
The International Conference on Hardware/Software Codesign and System Synthesis invites papers on all aspects of the design and architecture of semi-custom heterogeneous embedded computing systems such as medical devices, cell phones, network processors, handheld computers, automotive and multimedia systems, systems-on-a-chip (SoCs). Topics of interest include, but are not limited to:
Papers should represent original work not published or submitted for publication in other forums. Formal proceedings will be published by ACM SIGDA in hardcopy, web page, and a CD-ROM forms. Papers should be submitted electronically over the web. By Mar.15 the conference website will open its paper submission page that will guide the authors through the submission process. The paper must be in PDF and should not exceed 6 pages. It should follow the ACM two-column proceedings format at a minimum of 9pt on 8.5"x11", letter-sized page (no A4 please). For the purpose of anonymous review, DO NOT REVEAL AUTHORSHIP DIRECTLY OR INDIRECTLY THROUGH REFERENCES. LaTeX users: please make sure your PDF uses vectored fonts, not bitmapped fonts.
By submitting a paper, the authors agree to prepare the final camera ready version and to present the paper in person at the conference, if the paper is accepted.
Proposals for group discussions and special sessions are also invited. These should be single page proposals succinctly outlining the topic, problem(s) addressed, positioning and likely participants. Attention must be paid to audience participation in such discussions. While all technical topics within the areas of interest are welcome, we are especially interested in emerging technical areas.
Papers submitted after the deadline,exceeding the page limit, or unveiling the authorship will automatically be rejected.
General Co-chairs:
Alex Orailoglu, University of California, San Diego, USA
Pai H. Chou, University of California, Irvine, USA
Program Co-chairs:
Petru Eles, Linkoping University, Sweden
Axel Jantsch, Royal Institute of Technology, Sweden
Past Co-chairs:
Rajesh Gupta, University of California, San Diego, USA
Yukihiro Nakamura, Kyoto University, Japan
Finance Chair:
Reinaldo Bergamaschi, IBM TJ Watson, USA
Local Arrangements Chair:
Johnny Öberg, Royal Institute of Technology, Sweden
Panels Chair:
Peter Marwedel, University of Dortmund, Germany
Publications Chair:
Harry Hsieh, University of California, Riverside, USA
Publicity Chair:
Tony Givargis, University of California, Irvine, USA
Registration Chair:
Paul Pop, Linkoping University, Sweden
Special Sessions Chair:
Joerg Henkel, University of Karlsruhe, Germany
Workshops Chair:
Sharon Hu, University of Notre Dame, USA
Electronic Media Chair:
Ismet Bayaktaroglu, Sun Microsystems, USA
A/V Chair:
JoAnn Paul, Carnegie Mellon University, USA
Awards Chair:
Mostapha Aboulhamid, University of Montreal, Canada
Administrative Support:
Lena Beronius, Royal Institute of Technology, Sweden
Liaisons
Industry Liaisons:
Grant Martin, Tensilica Inc., USA
Per Bjureus, SaabTech AB, Sweden
Marcello Coppola, ST Microelectronics, France
CASS Liaison:
Giovanni De Micheli, Stanford University, USA
ACM SIGDA Liaison:
Bob Walker, Kent State University, USA
ACM SIGBED:
Janos Sztipanovits, Vanderbilt University, USA
ACM SIGSOFT:
Mary Jean Harrold, Georgia Tech, USA
IFIP Liaison:
Nikil Dutt, University of California, Irvine, USA
Computer Society Liaison:
Wayne Wolf, Princeton University, USA
IEE Liaison:
Bashir Al-Hashimi, University of Southampton, UK
Latin Connection:
Ricardo Reis, University Fed Rio Grande, Brazil
Asian Liaison:
Hiroto Yasuura, Kyushu University
Program Committee:
Guido Araujo, State University Campinas, Brazil
Luca Benini, University of Bologna, Italy
Joe Buck, Synopsys, USA
Raul Camposano, Synopsys, USA
Ali Dasdan, Synopsys, USA
Sujit Dey, University of California, San Diego, USA
Rolf Ernst, TU Braunschweig, Germany
Daniel Gajski, University of California, Irvine, USA
Cathy Gebotys, University of Waterloo, Canada
Soonhoi Ha, Seoul National University, Korea
Roman Hermida, Universidad Complutense, Spain
Niraj Jha, Princeton University, USA
Faraydon Karim, ST Microelectronics, USA
Erwin de Kock, Philips, The Netherlands
Fadi J. Kurdahi, University of California, Irvine, USA
Luciano Lavagno, Politecnico Torino, Italy
Jan Madsen, Technical University of Denmark, Denmark
Radu Marculescu, Carnegie Mellon University, USA
Anne Mignotte, INSA Lyon, France
Miguel Miranda, IMEC, Belgium
Vincent Mooney, Georgia Tech, USA
Walid Najjar, University of California, Riverside, USA
Preeti R. Panda, Indian Institute of Technology, Delhi, India
Sri Parameswaran, University of South Wales, Australia
Wolfgang Rosenstiel, University of Tuebingen, Germany
Alberto Sangiovanni-Vincentelli, University of California, Berkeley, USA
Majid Sarrafzadeh, University of California, Los Angeles, USA
Donatella Sciuto, Politecnico di Milano, Italy
Edwin Sha, University of Texas at Dallas, USA
Juergen Teich, Universitat Erlangen-Nurnberg, Germany
Don Thomas, Carnegie Mellon University, USA
Hiroyuki Tomiyama, Nagoya University, Japan
Frank Vahid, University of California, Riverside, USA
Stamatis Vassiliadis, Technical University of Delft, The Netherlands
Kazutoshi Wakabayashi, NEC, Japan
Albert van der Werf, Philips, The Netherlands
Fabian Wolf, Volkswagen AG, Germany
Allen C.-H. Wu, National Tsinghua Univ, Taiwan
Sungjoo Yoo, TIMA, Grenoble, France