Multi-Temperature Testing for Core-based System-on-Chip
Design Automation and Test in Europe (DATE'2010), Dresden, Germany, March 8-12, 2010, pp. 208-213.
Recent research has shown that different defects can manifest themselves as failures at different temperature spectra. Therefore, we need multi-temperature testing which applies tests at different temperature levels. In this paper, we discuss the need and problems for testing core-based systems-on-chip at different temperatures. To address the long test time problem for multi-temperature test, we propose a test scheduling technique that generates the shortest test schedules while keeping the cores under test within a temperature interval. Experimental results show the efficiency of the proposed technique.
[HPE10] Zhiyuan He, Zebo Peng, Petru Eles, "Multi-Temperature Testing for Core-based System-on-Chip", Design Automation and Test in Europe (DATE'2010), Dresden, Germany, March 8-12, 2010, pp. 208-213.