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zebpe_VLSI-DAT14

Thermal Challenges to Building Reliable Embedded Systems

Zebo Peng Author homepage

Invited paper, Proc. International Symposium on VLSI Design, Automation and Test (VLSI-DATí14), Hsinchu, Taiwan, Apr. 28-30, 2014.

ABSTRACT
More and more embedded systems are used in safety-critical areas such as automotive electronics and medical applications. These safety-critical applications impose stringent requirements on reliability, performance, low-power and testability of the underlying VLSI circuits. With silicon technology scaling, however, VLSI circuits operate very often at high temperature, which has negative impact on reliability, performance, power-efficiency and testability. This paper discusses several thermal impacts on VLSI circuits and their related challenges. It presents also a few emerging techniques that take temperature into account in the design and test processes.


Related files:
zebpe_VLSI-DAT14.pdfAdobe Acrobat portable document


[P14] Zebo Peng, "Thermal Challenges to Building Reliable Embedded Systems", Invited paper, Proc. International Symposium on VLSI Design, Automation and Test (VLSI-DATí14), Hsinchu, Taiwan, Apr. 28-30, 2014.
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