Measurement Point Selection for In-Operation Wear-Out Monitoring
14th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS11), Cottbus, Germany, April 13-15, 2011.
ABSTRACT
In recent IC designs, the risk of early failure due to electromigration wear-out has increased due to reduced feature dimensions. To give a warning of impending failure, wearout monitoring approaches have included delay measurement circuitry on-chip. Due to the high cost of delay measurement circuitry this paper presents a method to reduce the number of necessary measurement points. The proposed method is based on identification of wear-out sensitive interconnects and selects a small number of measurement points that can be used to observe the state of all the wear-out sensitive interconnects. The method is demonstrated on ISCAS85 benchmark ICs with encouraging results.
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[ICL11] Urban Ingelsson, Shih-Yen Chang, Erik Larsson, "Measurement Point Selection for In-Operation Wear-Out Monitoring", 14th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS11), Cottbus, Germany, April 13-15, 2011. |
